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IBM Microelectronics was set to cut the ribbon Wednesday morning at the new plant in East Fishkill, N.Y.
IBM plans to use the new 140,000-square-foot plant as a foundry to forge chips for other companies. The plant will use 300-millimeter wafers and advanced manufacturing and materials technologies such as silicon on insulator and low-capacitance dielectrics, which shield transistors from electrical interference that can hinder performance.
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