Advanced Micro Devices’ new Mobile Sempron processor gives the company a fresh chip for the holiday season, but it probably won’t help it overcome the solid advantage that rival Intel holds in the notebook market.

The new Mobile Sempron 3000+ is designed for thin-and-light notebooks, usually categorized as systems weighing about 5 pounds. Two European PC manufacturers, Gericom and Packard Bell NEC, plan to release new notebooks based on the chip before the end of the year, AMD says in a statement Tuesday.

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Hopefully, the new Sempron line, based as it is on a 90 nm SOI die, will chip away (ahem) at the heat problem experienced with so many notebook systems.